UPVfab welcomes PICadvanced, its first resident international photonics company
UPVfab, the innovation centre of the Universitat Politècnica de València (UPV), has welcomed its first international resident company: the…
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Universitat Politècnica de València
500 m² of ISO-7 cleanroom space and automation tools for semiconductor backend processing at Universitat Politècnica de València.
Hybrid integration of photonic chips using advanced flip-chip bonding and silicon nitride waveguide platforms.
Full backend processing of semiconductor wafers with ISO-7 grade deposition, lithography, and etching.
Automated tools for die attach, wire bonding, and encapsulation services for photonic and electronic chips.
Open access to equipment and process expertise for universities, institutes, and industrial partners.
Co-location of companies within UPVfab facilities with shared infrastructure and technical support.
Bridging academic research and industrial deployment through pilot line validation and process transfer.
We are the result of the joint work of UPV research institutes specialised in photonics, chemistry and electronics, bringing together expertise to drive innovation in deep tech and semiconductor technologies.
Discover our ecosystemUPVfab, the innovation centre of the Universitat Politècnica de València (UPV), has welcomed its first international resident company: the…
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Nearly three years after the UPVfab facilities were equipped with hybrid integration photonic technology, the in-house laboratory of the…
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The “Photonic Integration Week” is an in-person networking event. However we understand agendas are tightly packed, and we do not want you miss…
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